IEC 61189-2-807-ed.1.0

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA

STANDARD published on 3.9.2021

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The information about the standard:

Designation standards: IEC 61189-2-807-ed.1.0
Publication date standards: 3.9.2021
The number of pages: 17
Approximate weight : 51 g (0.11 lbs)
Country: International technical standard
Category: Technical standards IEC

Annotation of standard text IEC 61189-2-807-ed.1.0 :

IEC 61189-2-807:2021 specifies a test method to determine the decomposition temperature (Td) of base laminate materials using thermogravimetric analysis (TGA). LIEC 61189-2-807:2021 specifie une methode dessai pour determiner la temperature de decomposition (Td) des materiaux stratifies de base par analyse thermogravimetrique (TGA, thermogravimetric analysis).