Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
STANDARD published on 8.1.2015
Designation standards: IEC 61189-5-4-ed.1.0
Publication date standards: 8.1.2015
The number of pages: 45
Approximate weight : 135 g (0.30 lbs)
Country: International technical standard
Category: Technical standards IEC
IEC 61189-5-4:2015 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods for solder alloys, fluxed and non-fluxed solid wire, based on existing IEC 61189-5 and IEC 61189-6. In addition, it includes test methods for solder alloys, fluxed and non-fluxed solid wire, and for lead free soldering. This publication is to be read in conjunction with IEC 61189-1:1997, IEC 61189-2:2006 and IEC 61189-3:2007. LIEC 61189-5-4:2015 est un catalogue de methodes dessai representant les methodologies et modes operatoires pouvant etre appliques aux assemblages de cartes imprimees. La presente partie de lIEC 61189 traite des methodes dessai pour les alliages a braser et les brasages solides fluxes et non fluxes sur la base des IEC 61189-5 et IEC 61189-6 existantes. De plus, elle inclut les methodes dessai pour les alliages a braser et les brasages solides fluxes et non fluxes pour le brasage sans plomb. Cette publication doit etre lue conjointement avec la CEI 61189-1:1997, la CEI 61189-2:2006 et la CEI 61189-3:2007.