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IEC 61190-1-1-ed.1.0

Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly

STANDARD published on 25.3.2002

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The information about the standard:

Designation standards: IEC 61190-1-1-ed.1.0
Publication date standards: 25.3.2002
The number of pages: 41
Approximate weight : 123 g (0.27 lbs)
Country: International technical standard
Category: Technical standards IEC

Annotation of standard text IEC 61190-1-1-ed.1.0 :

Specifies general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly. This standard is a flux characterization, quality control, and procurement document for solder flux and flux containing material in electronics assembly technology. Specifie les exigences dordre general relatives a la classification et au controle des flux de brasage pour les interconnexions de haute qualite dans lassemblage des composants electroniques. La presente norme represente une caracterisation du flux, un controle de la qualite et un document de commande pour les flux a braser et les flux constitues de materiaux au sein de la technologie dassemblage des composants electroniques.