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IEC 61837-1-ed.2.0

Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 1: Plastic moulded enclosure outlines

STANDARD published on 20.4.2012

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The information about the standard:

Designation standards: IEC 61837-1-ed.2.0
Publication date standards: 20.4.2012
The number of pages: 44
Approximate weight : 132 g (0.29 lbs)
Country: International technical standard
Category: Technical standards IEC

Annotation of standard text IEC 61837-1-ed.2.0 :

IEC 61837-1:2012 deals with standard outlines and terminal lead connections as they apply to SMDs for frequency control and selection in plastic moulded enclosures and is based on IEC 61240. This publication is to be read in conjunction with IEC 61240:1994. La CEI 61837-1:2012 traite des encombrements normalises et connexions des sorties des dispositifs a montage en surface pour la commande et le choix de la frequence, applicables aux enveloppes en plastique moulees, et elle est basee sur la CEI 61240. Cette publication doit etre lue conjointement avec la CEI 61240:1994.