IEC 61837-2-ed.3.1+Amd.1-CSV

Annotation of standard text IEC 61837-2-ed.3.1+Amd.1-CSV :

IEC 61837-2:2018+A1:2020 deals with standard outlines and terminal lead connections as they apply to surface-mounted devices (SMD) for frequency control and selection in ceramic enclosures, and is based on IEC 61240:2016. This edition includes the following significant technical changes with respect to the previous edition: a. revision of the figures to match the notation of the drawings of IEC 61240:2016; b. addition of 7 enclosures as follows: DCC-6/5032A, DCC-6/3225A, DCC-4/3215C, DCC-6/2016A, DCC-2/2012C, DCC-2/1610C, DCC-4/1210C. As a result, this third edition contains a total of 45 enclosure types, which are listed in Table 1. This consolidated version consists of the third edition (2018) and its amendment 1 (2020). Therefore, no need to order amendment in addition to this publication. L’IEC 61837-2:2018+A1:2020 traite des encombrements normalises et des connexions des sorties des dispositifs a montage en surface pour la commande et le choix de la frequence applicables aux enveloppes en ceramique, et est basee sur l’IEC 61240:2016. La presente edition inclut les modifications techniques majeures suivantes par rapport a ledition precedente: a. revision des figures pour correspondre a la notation des dessins de lIEC 61240:2016; b. ajout des 7 enveloppes suivantes: DCC-6/5032A, DCC-6/3225A, DCC-4/3215C, DCC-6/2016A, DCC-2/2012C, DCC-2/1610C, DCC-4/1210C. Par consequent, la presente troisieme edition contient 45 types denveloppes, dont la liste est donnee au Tableau 1. Cette version consolidee comprend la troisieme edition (2018) et son amendement 1 (2020). Il nest donc pas necessaire de commander lamendement avec cette publication.