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IEC 61837-2-ed.3.2+Amd.1+Amd.2-CSV

Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures

STANDARD published on 18.6.2026

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The information about the standard:

Designation standards: IEC 61837-2-ed.3.2+Amd.1+Amd.2-CSV
Publication date standards: 18.6.2026
The number of pages: 228
Approximate weight : 715 g (1.58 lbs)
Country: International technical standard
Category: Technical standards IEC

Annotation of standard text IEC 61837-2-ed.3.2+Amd.1+Amd.2-CSV :

IEC 61837-2:2018+AMD1:2020+AMD2:2026 CSV deals with standard outlines and terminal lead connections as they apply to surface-mounted devices (SMD) for frequency control and selection in ceramic enclosures, and is based on IEC 61240:2016. This edition includes the following significant technical changes with respect to the previous edition: - revision of the figures to match the notation of the drawings of IEC 61240:2016; - addition of 7 enclosures as follows: DCC-6/5032A, DCC-6/3225A, DCC-4/3215C, DCC-6/2016A, DCC-2/2012C, DCC-2/1610C, DCC-4/1210C. As a result, this third edition contains a total of 45 enclosure types, which are listed in Table 1.