IEC 62258-6-ed.1.0

Semiconductor die products - Part 6: Requirements for information concerning thermal simulation

STANDARD published on 28.8.2006

English -
electronic design (pdf) (60.40 USD)

English -

Print design (60.40 USD)

English -

CD-ROM (62.30 USD)

The information about the standard:

Designation standards: IEC 62258-6-ed.1.0
Publication date standards: 28.8.2006
The number of pages: 9
Approximate weight : 27 g (0.06 lbs)
Country: International technical standard
Category: Technical standards IEC

Annotation of standard text IEC 62258-6-ed.1.0 :

Determines the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. Intends to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2