Field device integration (FDI®) - Part 8:EDD to OPC-UA Mapping<
STANDARD published on 5.4.2023
Designation standards: IEC 62769-8-ed.1.0
Publication date standards: 5.4.2023
Approximate weight : 300 g (0.66 lbs)
Country: International technical standard
Category: Technical standards IEC
IEC 62769-8:2023 specifies how the internal view of a device model represented by the EDD can be transferred into an external view as an OPC-UA information model by mapping EDD constructs to OPC-UA objects. LIEC 62769-8:2023 specifie comment la vue interne dun modele dappareil representee par lEDD peut etre transferee dans une vue externe sous forme de modele dinformation OPC-UA en mappant les constructions EDD avec des objets OPC-UA.