IEC 62899-202-9-ed.1.0

Printed electronics - Part 202-9: Materials - Conductive ink - Printed patterns for mechanical test

STANDARD published on 3.8.2023

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The information about the standard:

Designation standards: IEC 62899-202-9-ed.1.0
Publication date standards: 3.8.2023
Approximate weight : 300 g (0.66 lbs)
Country: International technical standard
Category: Technical standards IEC

Annotation of standard text IEC 62899-202-9-ed.1.0 :

IEC 62899-202-9:2023 describes basic patterns to evaluate the electrical reliability of a conductive layer under mechanical deformation. Using the standard pattern described in this document, the comparison of the electrical reliability of a conductive layer under mechanical deformation is possible when the sample dimension is identical.