IEC/TS 62647-2-ed.1.0

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin

STANDARD published on 29.11.2012

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The information about the standard:

Designation standards: IEC/TS 62647-2-ed.1.0
Publication date standards: 29.11.2012
The number of pages: 68
Approximate weight : 204 g (0.45 lbs)
Country: International technical standard
Category: Technical standards IEC

Annotation of standard text IEC/TS 62647-2-ed.1.0 :

IEC/TS 62647-2:2012(E) establishes processes for documenting the mitigating steps taken to reduce the harmful effects of Pb-free tin in electronic systems. This Technical Specification is applicable to aerospace, defence, and high performance (ADHP) electronic applications which procure equipment that may contain Pb-free tin finishes. It may be used by other high-performance and high-reliability industries, at their discretion.