IEC 62418-ed.1.0

Semiconductor devices - Metallization stress void test

STANDARD published on 22.4.2010

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The information about the standard:

Designation standards: IEC 62418-ed.1.0
Publication date standards: 22.4.2010
The number of pages: 34
Approximate weight : 102 g (0.22 lbs)
Country: International technical standard
Category: Technical standards IEC

Annotation of standard text IEC 62418-ed.1.0 :

IEC 62418:2010 describes a method of metallization stress void test and associated criteria. It is applicable to aluminium (Al) or copper (Cu) metallization. La CEI 62418:2010 decrit une methode dessai sur les cavites dues aux contraintes generees par la metallisation et les criteres associes. Elle sapplique a la metallisation a laluminium (Al) ou au cuivre (Cu).