Industrial automation systems and integration — Product data representation and exchange — Part 1685: Application module: Interconnect module to assembly module relationship

The information about the standard:

Designation standards: ISO/TS 10303-1685:2018-ed.4.0
Publication date standards: 18.12.2018
Approximate weight : 300 g (0.66 lbs)
Country: International technical standard
Category: Technical standards ISO

Annotation of standard text ISO/TS 10303-1685:2018-ed.4.0 :

Description / Abstract: ISO/TS 10303-1685:2018-11 specifies the application module for Interconnect module to assembly module relationship. The following are within the scope of ISO/TS 10303-1685:2018-11: assembly requirement for interconnect substrate;assembly component based symbol placement in substrate requirement;assembly component based annotation text placement in substrate requirement;assembly component feature to layout feature requirement relationship;external references for assembly component;external references for assembly component feature;