Industrial automation systems and integration — Product data representation and exchange — Part 1688: Application module: Interconnect non planar shape
STANDARD published on 18.5.2010
Designation standards: ISO/TS 10303-1688:2010-ed.2.0
Publication date standards: 18.5.2010
Approximate weight : 300 g (0.66 lbs)
Country: International technical standard
Category: Technical standards ISO
Description / Abstract: ISO/TS 10303-1688:2010-03 specifies the application module for Interconnect non planar shape. The following are within the scope of ISO/TS 10303-1688:2010-03: three dimensional manifold surface representation of an interconnect substrate;placement of footprint and other planar feature definitions in a three dimensional manifold surface representation including changing the planar shape to a manifold shape.