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ISO/TS 10303-1698:2018-ed.6.0

Industrial automation systems and integration — Product data representation and exchange — Part 1698: Application module: Layered interconnect module design

STANDARD published on 18.12.2018

The information about the standard:

Designation standards: ISO/TS 10303-1698:2018-ed.6.0
Publication date standards: 18.12.2018
Approximate weight : 300 g (0.66 lbs)
Country: International technical standard
Category: Technical standards ISO

Annotation of standard text ISO/TS 10303-1698:2018-ed.6.0 :

Description / Abstract: ISO/TS 10303-1700:2018-11 specifies the application module for Layered interconnect module with printed component design. The following are within the scope of ISO/TS 10303-1700:2018-11: printed components; routed printed components; printed connectors; items within the scope of application module Land, ISO/TS 10303-1692; items within the scope of application module Printed physical layout template, ISO/TS 10303-1737.