Industrial automation systems and integration — Product data representation and exchange — Part 1716: Application module: Layered interconnect complex template
STANDARD published on 18.12.2018
Designation standards: ISO/TS 10303-1716:2018-ed.5.0
Publication date standards: 18.12.2018
Approximate weight : 300 g (0.66 lbs)
Country: International technical standard
Category: Technical standards ISO
Description / Abstract: ISO/TS 10303-1716:2018-11 specifies the application module for Layered interconnect complex template. The following are within the scope of ISO/TS 10303-1716:2018-11: footprint definition; footprint definition shape; padstack definition; padstack definition shape; items within the scope of application module Layered interconnect simple template, ISO/TS 10303-1718; items within the scope of application module Physical unit 2d shape, ISO/TS 10303-1726.