
Semiconductor devices -- Micro-electromechanical devices -- Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
STANDARD published on 20.2.2014
Designation standards: JIS C5630-12:2014
Publication date standards: 20.2.2014
The number of pages: 24
Approximate weight : 72 g (0.16 lbs)
Country: Other standards
Category: Technical standards JIS