JIS C5630-18:2014

Semiconductor devices -- Micro-electromechanical devices -- Part 18: Bend testing methods of thin film materials

STANDARD published on 22.12.2014

Japanese -
electronic design (pdf) (ON REQUEST)

The information about the standard:

Designation standards: JIS C5630-18:2014
Publication date standards: 22.12.2014
The number of pages: 12
Approximate weight : 36 g (0.08 lbs)
Country: Other standards
Category: Technical standards JIS