JIS C61191-3:2020

Printed board assemblies -- Part 3: Sectional specification -- Requirements for through-hole mount soldered assemblies

STANDARD published on 23.3.2020

Japanese -
electronic design (pdf) (ON REQUEST)

The information about the standard:

Designation standards: JIS C61191-3:2020
Publication date standards: 23.3.2020
The number of pages: 20
Approximate weight : 60 g (0.13 lbs)
Country: Other standards
Category: Technical standards JIS