JIS C61760-3:2022

Surface mounting technology -- Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering

STANDARD published on 22.8.2022

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The information about the standard:

Designation standards: JIS C61760-3:2022
Publication date standards: 22.8.2022
The number of pages: 44
Approximate weight : 132 g (0.29 lbs)
Country: Other standards
Category: Technical standards JIS