ÖVE EN IEC 61189-3-302

Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT) (( IEC 61189-3-302:2025) EN IEC 61189-3-302:2025) (german version)

STANDARD published on 1.9.2026

English -
electronic design (pdf) (130.50 USD)

English -

Print design (131.50 USD)

German -

electronic design (pdf) (134.60 USD)

German -

Print design (135.60 USD)

The information about the standard:

Designation standards: ÖVE EN IEC 61189-3-302
Publication date standards: 1.9.2026
The number of pages: 22
Approximate weight : 66 g (0.15 lbs)
Country: Austrian technische Norm
Category: Technical standards ÖNORM

Annotation of standard text ÖVE EN IEC 61189-3-302 :

In diesem Teil von IEC 61189 wird ein Verfahren zur Erkennung von Beschichtungsfehlern in unbestückten Leiterplatten durch Computertomographie (CT) beschrieben.