SAE AIR1141

1992 Report on Flip Chip and Beam Lead Bonding for Electronic Circuits (Canceled)

STANDARD published on 1.12.1971

English -
electronic design (pdf) (143.70 USD)

The information about the standard:

Designation standards: SAE AIR1141
Note: Historical
Publication date standards: 1.12.1971
Country: American technical standard
Category: Technical standards SAE