
Mechanical standardization of semiconductor devices. Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of quad flat packs (QFP)
STANDARD published on 1.4.2002
    
        Designation standards: STN EN 60191-6-3
                Classification mark:  358791
                
                Catalog number:  85951
                
                
               
                Publication date standards:  1.4.2002
        Approximate weight : 300 g (0.66 lbs)
        Country:          Slovak technical standard
        Category: Technical standards STN