
Mechanical standardization of semiconductor devices Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
STANDARD published on 1.3.2004
    
        Designation standards: STN EN 60191-6-4
                Classification mark:  358791
                
                Catalog number:  93542
                
                
               
                Publication date standards:  1.3.2004
        The number of pages: 19
Approximate weight : 57 g (0.13 lbs)
        Country:          Slovak technical standard
        Category: Technical standards STN