Mechanical standardization of semiconductor devices. Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for fine-pitch ball grid array (FBGA)
STANDARD published on 1.6.2002
Designation standards: STN EN 60191-6-5
Classification mark: 358791
Catalog number: 20122
Publication date standards: 1.6.2002
Approximate weight : 300 g (0.66 lbs)
Country: Slovak technical standard
Category: Technical standards STN