Mechanical standardization of semiconductor devices Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
STANDARD published on 1.3.2004
Designation standards: STN EN 60191-6-4
Classification mark: 358791
Catalog number: 93542
Publication date standards: 1.3.2004
The number of pages: 19
Approximate weight : 57 g (0.13 lbs)
Country: Slovak technical standard
Category: Technical standards STN