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STN EN IEC 60749-22-1 (358799)

Semiconductor devices - Mechanical and climatic test methods - Part 22-1: Bond strength - Wire bond pull test methods

STANDARD published on 1.4.2026

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The information about the standard:

Designation standards: STN EN IEC 60749-22-1
Classification mark: 358799
Catalog number: 142303
Publication date standards: 1.4.2026
Approximate weight : 54 g (0.12 lbs)
Country: Slovak technical standard
Category: Technical standards STN