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STN EN IEC 60749-22-2 (358799)

Semiconductor devices - Mechanical and climatic test methods - Part 22-2: Bond strength - Wire bond shear test methods

STANDARD published on 1.4.2026

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The information about the standard:

Designation standards: STN EN IEC 60749-22-2
Classification mark: 358799
Catalog number: 142291
Publication date standards: 1.4.2026
Approximate weight : 48 g (0.11 lbs)
Country: Slovak technical standard
Category: Technical standards STN