Mechanical standardization of semiconductor devices -- Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) (Endorsed by AENOR in May of 2010.)
STANDARD published on 1.5.2010
Designation standards: UNE-EN 60191-6-18:2010
Publication date standards: 1.5.2010
The number of pages: 24
Approximate weight : 72 g (0.16 lbs)
Country: Spanish technical standard
Category: Technical standards UNE