Mechanical standardization of semiconductor devices -- Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage (Endorsed by AENOR in September of 2010.)
STANDARD published on 1.9.2010
Designation standards: UNE-EN 60191-6-19:2010
Publication date standards: 1.9.2010
The number of pages: 17
Approximate weight : 51 g (0.11 lbs)
Country: Spanish technical standard
Category: Technical standards UNE