Mechanical standardization of semiconductor devices -- Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (Endorsed by AENOR in February of 2011.)
STANDARD published on 1.2.2011
Designation standards: UNE-EN 60191-6-21:2010
Publication date standards: 1.2.2011
The number of pages: 18
Approximate weight : 54 g (0.12 lbs)
Country: Spanish technical standard
Category: Technical standards UNE