Mechanical standardization of semiconductor devices -- Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP) (Endorsed by AENOR in December of 2001.)
STANDARD published on 1.12.2001
Designation standards: UNE-EN 60191-6-3:2000
Publication date standards: 1.12.2001
The number of pages: 21
Approximate weight : 63 g (0.14 lbs)
Country: Spanish technical standard
Category: Technical standards UNE