Mechanical standardization of semiconductor devices -- Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) (Endorsed by AENOR in October of 2003.)
STANDARD published on 1.10.2003
Designation standards: UNE-EN 60191-6-4:2003
Publication date standards: 1.10.2003
The number of pages: 20
Approximate weight : 60 g (0.13 lbs)
Country: Spanish technical standard
Category: Technical standards UNE