
Mechanical standardization of semiconductor devices -- Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device package - Design guide for fine -pitch ball grid array (FBGA).
STANDARD published on 28.6.2002
Designation standards: UNE-EN 60191-6-5:2002
Publication date standards: 28.6.2002
The number of pages: 19
Approximate weight : 57 g (0.13 lbs)
Country: Spanish technical standard
Category: Technical standards UNE