Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
STANDARD published on 6.10.2023
Designation standards: UNE-EN 60749-20:2009
Note: WITHDRAWN
Publication date standards: 6.10.2023
The number of pages: 31
Approximate weight : 93 g (0.21 lbs)
Country: Spanish technical standard
Category: Technical standards UNE