UNE-EN 60749-22:2004

Semiconductor devices - Mechanical and climatic test methods -- Part 22: Bond strength

STANDARD published on 26.3.2004

English -
electronic design (pdf) (78.60 USD)

English -

Print design (86.50 USD)

Spanish -

electronic design (pdf) (78.60 USD)

Spanish -

Print design (86.50 USD)

The information about the standard:

Designation standards: UNE-EN 60749-22:2004
Publication date standards: 26.3.2004
The number of pages: 48
Approximate weight : 144 g (0.32 lbs)
Country: Spanish technical standard
Category: Technical standards UNE