Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (Endorsed by Asociación Espanola de Normalización in April of 2026.)
STANDARD published on 1.4.2026
Designation standards: UNE-EN IEC 60749-20-1:2026
Publication date standards: 1.4.2026
The number of pages: 48
Approximate weight : 144 g (0.32 lbs)
Country: Spanish technical standard
Category: Technical standards UNE