Semiconductor devices - Mechanical and climatic test methods - Part 22-2: Bond strength - Wire bond shear test methods (Endorsed by Asociación Espanola de Normalización in February of 2026.)
STANDARD published on 1.2.2026
Designation standards: UNE-EN IEC 60749-22-2:2026
Publication date standards: 1.2.2026
The number of pages: 43
Approximate weight : 129 g (0.28 lbs)
Country: Spanish technical standard
Category: Technical standards UNE