
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA (Endorsed by Asociación Espanola de Normalización in November of 2021.)
STANDARD published on 1.11.2021
Designation standards: UNE-EN IEC 61189-2-807:2021
Publication date standards: 1.11.2021
The number of pages: 17
Approximate weight : 51 g (0.11 lbs)
Country: Spanish technical standard
Category: Technical standards UNE