Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards (Endorsed by Asociación Espanola de Normalización in April of 2021.)
STANDARD published on 1.4.2021
Designation standards: UNE-EN IEC 61189-5-601:2021
Publication date standards: 1.4.2021
The number of pages: 50
Approximate weight : 150 g (0.33 lbs)
Country: Spanish technical standard
Category: Technical standards UNE