UNE-EN IEC 63378-3:2025

Thermal standardization on semiconductor packages - Part 3: Thermal circuit simulation models of discrete semiconductor packages for transient analysis (Endorsed by Asociación Espanola de Normalización in August of 2025.)

STANDARD published on 1.8.2025

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The information about the standard:

Designation standards: UNE-EN IEC 63378-3:2025
Publication date standards: 1.8.2025
The number of pages: 22
Approximate weight : 66 g (0.15 lbs)
Country: Spanish technical standard
Category: Technical standards UNE