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ASME 800156 - 1990 Advances in Thermal Modeling of Electronic Components and Systems: Volume 2
ASME 800156 - 1990 Advances in Thermal Modeling of Electronic Components and Systems: Volume 2
PUBLICATION published on 1.1.1990
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Product information:
Designation: ASME 800156 - 1990 Advances in Thermal Modeling of Electronic Components and Systems: Volume 2
The number of pages: 448
Approximate weight : 771 g (1.70 lbs)
Publication date: 1.1.1990
Country: American publication
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Annotation of standard text:
By Avram Bar-Cohen and Allan D. Kraus
The explosive growth in chip power dissipation, resulting from greater transistor density and electronic functionality, has spawned numerous studies of thermal control techniques for single chip packages and multichip modules. This book presents current information on: Air and liquid cooling; Extended surface arrays; and Heat sinks. In addition, it offers a critical review of recent technical and patent literature in electronics cooling. This text is of special value to program managers, technologist and packaging engineers in the electronics industry; and researchers in University and government laboratories.
Language: English
Desc: 800156 - 1990
ISBN: 9780791800157
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