Publications  ASME 800180 - 1993 Advances in Thermal Modeling of Electronic Components and Systems: Volume 3 1.1.1993 preview

ASME 800180 - 1993 Advances in Thermal Modeling of Electronic Components and Systems: Volume 3

ASME 800180 - 1993 Advances in Thermal Modeling of Electronic Components and Systems: Volume 3



PUBLICATION published on 1.1.1993


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Product information:

Designation: ASME 800180 - 1993 Advances in Thermal Modeling of Electronic Components and Systems: Volume 3
The number of pages: 450
Approximate weight : 726 g (1.60 lbs)
Publication date: 1.1.1993
Country: American publication
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Annotation of standard text:

By: Avram Bar-Cohen and Allan D. Kraus
This volume opens with a sweeping overview of the physical design of electronic systems-methodology, technology, and future challenges-thermally induced failures in electronic systems. Subsequent chapters examine the causes for thermally induced failures of electronic components and the techniques used to analyze and prevent such failures. It gives a comprehensive bibliograhy of project managers and lead engineers, packaging engineers and mechanical analysts, consultants, and academic, industrial, and government laboratory researchers.
Language: English
Desc: 800180 - 1993
ISBN: 9780791800188

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