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Resin, Polyimide, Sealing High-Temperature Resistant, 315 °C (600 °F) Unfilled
Standard published on 1.10.2016
Selected format:Adhesive, Polyimide Resin, Film and Paste High Temperature Resistant, 315 °C (599 °F)
Standard published on 1.1.2022
Selected format:Adhesive Film, Humidity-Resistant, Epoxy For Sandwich Panels, -55 to +95 °C (65 to +200 °F)
Standard published on 1.11.2016
Selected format:Adhesive, Foaming, Honeycomb Core Splice, Structural -55 to +82 °C (-65 to +180 °F)
Standard published on 1.8.2022
Selected format:Adhesive, Foaming, Honeycomb, Core Splice, Structural -54 to +177 °C (-65 to +350 °F)
Standard published on 1.8.2022
Selected format:Adhesive Compound, Epoxy Room Temperature Curing
Standard published on 1.11.2016
Selected format:Adhesive Compound, Epoxy Resin High Temperature Application
Standard published on 1.1.2022
Selected format:Adhesive, Modified Epoxy Moderate Heat Resistant, 120 °C (250 °F) Curing, Film Type
Standard published on 1.11.2016
Selected format:Aerodynamic Smoothing Compound, Flexible -55° to +130°C (-65° to +270°F)
Standard published on 1.1.2012
Selected format:Adhesive Film, Epoxy-Base for High Durability Structural Adhesive Bonding
Standard published on 1.1.2022
Selected format:Latest update: 2026-06-10 (Number of items: 2 281 917)
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