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Adhesive Film, Hot-Melt, Addition-Type Polyimide For Foam Sandwich Structure, -55 to +230 °C (-65 to +450 °F)
Standard published on 1.11.2016
Selected format:Resin System, Epoxy, Carbon Microballoon Filled, 135 °C (275 °F) Cure
Standard published on 1.12.2022
Selected format:EPOXY RESIN, TETRAGLYCIDYL METHYLENEDIANILINE (TGMDA) 10,000 – 14,000 Centipoise Viscosity
Standard published on 1.10.1995
Selected format:EPOXY RESIN, TETRAGLYCIDYL METHYLENEDIANILINE 14,000 - 18,000 Centipoise Viscosity
Standard published on 1.10.1995
Selected format:Adhesive, Contact Polychloroprene (CR) Rubber, Resin Modified
Standard published on 1.3.2019
Selected format:Epoxy Resin, Cycloaliphatic Liquid
Standard published on 1.10.2022
Selected format:Syntactic Foam Tiles
Standard published on 1.11.2016
Selected format:Sandwich Structures, Glass Fabric-Resin Low Pressure Molded, Heat Resistant
Standard published on 1.12.2022
Selected format:Core, Honeycomb Fibrous, Aramid Base, Phenolic Coated
Standard published on 1.7.2013
Selected format:Core, Honeycomb, Glass/Polyimide
Standard published on 1.8.2022
Selected format:Latest update: 2026-05-15 (Number of items: 2 278 685)
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