Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications.

WITHDRAWN published on 12.8.2002

Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications.

WITHDRAWN published on 31.3.2011

Printed board assemblies. Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies.

WITHDRAWN published on 15.1.1999

Printed board assemblies. Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies.

WITHDRAWN published on 30.9.2013

Printed board assemblies. Sectional specification. Requirements for surface mount soldered assemblies.

WITHDRAWN published on 15.1.1999

Printed board assemblies. Sectional specification. Requirements for surface mount soldered assemblies.

WITHDRAWN published on 31.10.2013

Printed board assemblies. Sectional specification. Requirements for through-hole mount soldered assemblies.

WITHDRAWN published on 15.1.1999

Printed board assemblies. Sectional specification. Requirements for terminal soldered assemblies.

WITHDRAWN published on 15.1.1999

Workmanship requirements for soldered electronic assemblies. General.

WITHDRAWN published on 26.6.2003

Workmanship requirements for soldered electronic assemblies. Surface-mount assemblies.

WITHDRAWN published on 25.6.2003