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BSi – The company, BSI British Standards, is a national standards body of the United Kingdom (NBS) and it was actually the very first one in the world. It represents national and social interests of Great Britain in all European and international standardization organizations and in the development of business information of British institutions of all sizes and sectors. BSI British Standards cooperates with manufacturing and service industries, various companies, the government and with consumers as well in order to facilitate the production of British, European and international standards. A part of BSI Group, BSI British Standards, works closely with the government of the United Kingdom, especially in the Department for Innovations, Universities and Skills (DIUS).
Metal-clad base materials for printed wiring boards. Copper-clad base materials. Specification for phenolic cellulose paper copper-clad laminated sheet of defined flammability (horizontal burning test).
WITHDRAWN published on 31.7.1990
Selected format:Metal-clad base materials for printed wiring boards. Copper-clad base materials. Specification for phenolic cellulose copper-clad laminated sheet of defined flammability (vertical burning test).
WITHDRAWN published on 28.2.1990
Selected format:Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits. Specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed board.
WITHDRAWN published on 28.2.1990
Selected format:Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits. Specification for permanent polymer coating materials (solder resist) for use in the fabrication of printed boards.
WITHDRAWN published on 31.3.1992
Selected format:Specification for metal-clad base materials for printed circuits. Bonding sheet material for use in the fabrication of multilayer printed boards: EP-GC-11.
WITHDRAWN published on 30.12.1977
Selected format:Specification for metal-clad base materials for printed circuits. Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards: EP-GC-Cu-12.
WITHDRAWN published on 30.9.1982
Selected format:Specification for metal-clad base materials for printed circuits. Silicone woven glass fabric copper-clad laminated sheet Si-GC-Cu-13.
WITHDRAWN published on 30.11.1977
Selected format:Specification for metal-clad base materials for printed circuits. Phenolic cellulose paper copper-clad laminated sheet of medium electrical quality and defined flammability: grade PF-CP-Cu-14.
WITHDRAWN published on 28.2.1978
Selected format:Metal-clad base materials for printed wiring boards. Specification for phenolic cellulose paper copper-clad laminated sheet of defined flammability (horizontal burning test).
WITHDRAWN published on 28.2.1989
Selected format:Metal-clad base materials for printed wiring boards. Adhesive coated polymeric films: PETP-F-15 and PI-F-15.
WITHDRAWN published on 31.10.1978
Selected format:Latest update: 2026-04-22 (Number of items: 2 274 512)
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