Standards BS - British national standards - Page 7768

Test procedure for the determination of the temperature index of enamelled winding wires.

WITHDRAWN published on 31.5.2010

Test procedure for the determination of the temperature index of enamelled and tape wrapped winding wires.

WITHDRAWN published on 31.7.2015

Tracked Changes. Test procedure for the determination of the temperature index of enamelled and tape wrapped winding wires.

WITHDRAWN published on 26.2.2020

Method of test for accuracy and precision of mechanical handpipettes down to 0.05 ml capacity.

WITHDRAWN published on 30.9.1987

Method of test for accuracy and precision of mechanical handpipettes of capacity 0.05 mL and above.

WITHDRAWN published on 20.12.1991

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of discrete devices.

WITHDRAWN published on 29.6.2007

Mechanical standardization of semiconductor devices. Coding system and classification into forms of package outlines for semiconductor device packages.

WITHDRAWN published on 19.2.2003

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for fine-pitch land grid array (FLGA). Rectangular type.

WITHDRAWN published on 24.9.2002

Mechanical standardization of semiconductor devices. Design guideline of open-top-type sockets for fine-pitch ball grid array and fine-pitch land grid array (FBGA/FLGA).

WITHDRAWN published on 31.1.2008

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages.

WITHDRAWN published on 18.2.2005