We need your consent to use the individual data so that you can see information about your interests, among other things. Click "OK" to give your consent.
Test method for thermal shock of electronic glass
WITHDRAWN published on 1.1.1988
Selected format:Test method for softening point of electronic glass
WITHDRAWN published on 1.1.1988
Selected format:Test method for annealing point and strain point of electronic glass
WITHDRAWN published on 1.1.1988
Selected format:Test method for viscosity of electronic glass while high temperature
WITHDRAWN published on 1.1.1988
Selected format:Test method for impact resistance strength of electronic glass
WITHDRAWN published on 1.1.1988
Selected format:Test method for temperature (Tk-100) -- volume resistivity of electronic glass
WITHDRAWN published on 1.1.1988
Selected format:Test method for high frequency dielectric losses and dielectric constant of electronic glass
WITHDRAWN published on 1.1.1988
Selected format:Inductor and transformer cores for telecommunications--Part 1:Generic specification
WITHDRAWN published on 30.6.1988
Selected format:Inductor and transformer cores for telecommunications--Part 2: sectional specification: Magnetic oxide cores for inductor applications
WITHDRAWN published on 30.6.1988
Selected format:Inductor and transformer cores for telecommunications--Part 2:Blank detail specification: Magnetic oxide cores for inductor applications--Assessment level A
WITHDRAWN published on 30.6.1988
Selected format:Latest update: 2026-04-23 (Number of items: 2 274 600)
© Copyright 2026 NORMSERVIS s.r.o.