Measurement techniques of piezoelectricdielectric and electrostatic oscillators—Part 3: Frequency aging test methods
Execute Date: march 2027

Standard published on 28.8.2026

Ferrite cores—Guidelines on dimensions and the limits of surface irregularities—Part 9Planar cores
Execute Date: march 2027

Standard published on 28.8.2026

Microscopes—Definition and measurement of illumination properties—Part 3:Incident light fluorescence microscopy with incoherent light sources
Execute Date: march 2027

Standard published on 28.8.2026

Integrated circuits—EMC evaluation of transceivers—Part 2:LIN transceivers
Execute Date: march 2027

Standard published on 28.8.2026

Integrated circuits—EMC evaluation of transceivers—Part 3:CAN transceivers
Execute Date: march 2027

Standard published on 28.8.2026

Semiconductor devices—Part 19-2:Smart sensors—Indication of specifications of smart sensors and power supplies for low power operation

Standard published on 27.8.2026

Semiconductor devices—Flexible and stretchable semiconductor devices—Part 1: Bending test method for conductive thin films on flexible substrates
Execute Date: march 2027

Standard published on 28.8.2026

Semiconductor devices—Flexible and stretchable semiconductor devices—Part 2: Evaluation method for electron mobility, sub-threshold swing, and threshold voltage of flexible devices
Execute Date: march 2027

Standard published on 28.8.2026

Semiconductor devices—Flexible and stretchable semiconductor devices—Part 3: Evaluation of thin film transistor characteristics on flexible substrates under bulging
Execute Date: march 2027

Standard published on 28.8.2026

Semiconductor devices—Flexible and stretchable semiconductor devices—Part 4:Fatigue evaluation for flexible conductive thin film on the substrate for flexible semiconductor devices
Execute Date: march 2027

Standard published on 28.8.2026