Micro-dose X-ray security inspection system—Part 1: General technical specifications
Execute Date: september 2027

Standard published on 27.8.2026

Micro-dose X-ray security inspection system—Part 2: Small and medium-sized transmission object security inspection system
Execute Date: september 2027

Standard published on 27.8.2026

Micro-dose X-ray security inspection system—Part 3:Large transmission object security inspection system
Execute Date: september 2027

Standard published on 27.8.2026

Micro-dose X-ray security inspection system—Part 4:Human body security inspection system
Execute Date: september 2027

Standard published on 27.8.2026

Micro-dose X-ray security inspection system—Part 5Backscatter object security inspection system
Execute Date: september 2027

Standard published on 27.8.2026

General technical specification for walk-through metal detector
Execute Date: september 2027

Standard published on 27.8.2026

General specification for probe tester
Execute Date: march 2027

Standard published on 28.8.2026

Mechanical standardization of semiconductor devices—Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
Execute Date: march 2027

Standard published on 28.8.2026

Mechanical standardization of semiconductor devices—Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
Execute Date: march 2027

Standard published on 28.8.2026

Limits of dimensions, axle load and masses for motor vehicles, trailers and combination vehicles
Execute Date: july 2027

Standard published on 27.8.2026